| abstract |
An object of the invention is to provide a circuit board that is provided for a semiconductor module, simplifies constituent members, reduces warpage, caused by temperature cycles under a high temperature condition, of the circuit board, and has an excellent bonding reliability of a bonding portion and an excellent heat dissipation property. n The circuit board includes a holding member, a bonding layer, an insulating substrate, a bonding layer, and a circuit wiring board, which are sequentially stacked in this order. The bonding layers are sintered bodies containing metal, the insulating substrate is made of non-oxide ceramic, and oxide layers are formed on both surfaces of the insulating substrate. |