http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2613910-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e0bf0928b608797b70bbc2b91c7e52e |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-3707 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B7-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-3776 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-3773 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-3723 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B7-30 |
| filingDate | 2011-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9e35d1c7eac43161e7c869e679ed7bf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a94e945a56a29bb7ae1a3d2d89e0ae42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6424e635caf64c9b84dc18cbd487e99 |
| publicationDate | 2013-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-2613910-A1 |
| titleOfInvention | Process for chemically mechanically polishing substrates containing silicon oxide dielectric films and polysilicon and/or silicon nitride films |
| abstract | CMP process for substrates containing silicon oxide dielectric films and polysilicon and/or silicon nitride films comprising the steps of (1 ) contacting the substrate with an aqueous composition containing (A) abrasive particles which are positively charged when dispersed in an aqueous medium having a pH in the range of from 3 to 9; (B) a water-soluble or water-dispersible linear or branched alkylene oxide homopolymer or copolymer; and (C) a water-soluble or water-dispersible polymer selected from (c1 ) aliphatic and cycloaliphatic poly(N-vinylamide) homopolymers and copolymers, (c2) homopolymers and copolymers of acrylamide monomers of the general formulas I and II: H 2 C=C(-R)-C(=0)-N(-R 1 )(-R 2 ) (I), H 2 C=C(-R)-C(=0)-R 3 (II), wherein the variables have the following meaning R hydrogen atom, fluorine atom, chlorine atom, nitrile group, or organic residue; R 1 and R 2 hydrogen atom or organic residue; R 3 saturated N-heterocyclic ring; (c3) cationic polymeric flocculants; and (c4) mixtures thereof; (2) polishing the substrate until the silicon oxide dielectric film is removed and the polysilicon and/or silicon nitride film is or are exposed exposed. |
| priorityDate | 2010-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 1122.