| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_01dc8a8a3ae90ebd3658b65c494e2a4d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31942
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-67 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K23-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-20 |
| filingDate |
2011-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bbbe06900f069a1e2b81a5a919d1351
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d171403baa93f6778a5ed8359e79d4d6 |
| publicationDate |
2013-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2608217-A1 |
| titleOfInvention |
A dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a sintering additive |
| abstract |
The present invention relates to conductive compositions comprising a specific carboxylic acid as sintering additive. It further relates to a method to prepare such compositions. n The compositions of the present invention allow a reduction of the curing time and/or a lowering of the curing temperature when applied to a substrate. Thus, the present invention also relates to a process for curing said conductive compositions and to coated layers or patterns thereof. n The present invention is useful to apply conductive compositions on various substrates including thermo-sensitive substrates having a melting point below 200°C and to speed up processes for making conductive layers and/or patterns by substantially reducing the curing times. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10103026-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3287499-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3037161-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10468256-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3478663-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018037072-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016189016-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3099145-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3099146-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9771485-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10676630-B2 |
| priorityDate |
2011-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |