| abstract |
There is provided a process for forming a contained second layer over a first layer, including the steps: forming the first layer having a first surface energy; treating the first layer with a priming material to form a priming layer; exposing the priming layer patternwise with radiation resulting in exposed areas and unexposed areas; developing the priming layer to effectively remove the priming layer from the unexposed areas resulting in a first layer having a pattern of priming layer, wherein the pattern of priming layer has a second surface energy that is higher than the first surface energy; and forming the second layer by liquid depositions on the pattern of priming layer on the first layer. The priming material has Formula I or Formula I': In Formula I or Formula I': Ar 1 and Ar 2 are the same or different and are aryl groups; R 1 through R 5 are independently the same or different at each occurrence and are D, F, alkyl, aryl, alkoxy, silyl, or a crosslinkable group; R 6 is H, D, or halogen; a through e are independently an integer from 0 to 4; f is 1 or 2; g is 0, 1 or 2; h is 1 or 2; and n is an integer greater than 0. |