abstract |
The silicon-containing curable composition of the present invention includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of a organosilane mixture including 5 to 50 mol% of R 1 SiX 3 , 0 to 50 mol% of R 2 SiX 3 , 0 to 40 mol% of R 3 R 4 SiX 2 and 0 to 50 mol% of R 5 SiX 3 , wherein the total of R 2 SiX 3 and R 3 R 4 SiX2 is 5 to 60 mol%, 0 to 200 parts by mass of a prepolymer having two or more Si-H groups in one molecule obtainable by a hydrosilylation reaction of a copolymer of the formula (2) and a compound of the formula (3) or (3'), 0 to 30 parts by mass of a cyclic siloxane compound having two or more C-C double bonds having reactivity with Si-H groups in one molecule, 0.0001 to 10 parts by mass of an organic peroxide and 0 to 1.0 parts by mass of a metal catalyst, and 10 to 1,500 parts by mass of a filler, wherein R 1 is a C2-6 alkenyl group, R 2 is a C1-6 alkyl group, R 3 and R 4 are each a C1-6 alkyl group or the like, R 5 is a phenyl group optionally substituted with a C1-6 alkyl group, and X is a C1-6 alkoxy group or the like, one or more of R 2 to R 4 is a methyl group, R 6 to R 8 each represents a C1-6 alkyl group or a phenyl group, or the like, f represents a number of 2 to 10, g represents a number of 0 to 8, and n represents 1 or 2. |