| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ddb9f3656270bc5410be3679322fead |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-336
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J143-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J171-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-10 |
| filingDate |
2011-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47d51e84906a3760bb1f4abfe7588d59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a276d96435f86179816c67e723b1603 |
| publicationDate |
2013-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2578657-A1 |
| titleOfInvention |
Moisture-curing reactive hot melt adhesive composition |
| abstract |
Provided is a curable composition prepared using a less toxic reactive silyl group-containing polymer, wherein the curable composition is useful as a reactive hot melt adhesive having an excellent balance between storage stability at high temperatures and curability at room temperature. The moisture-curing reactive hot melt adhesive composition comprises either: (A1) an organic polymer containing a reactive silicon group having two hydrolyzable groups and, as a curing catalyst, (B1) a metal carboxylate and/or a carboxylic acid; or (A2) an organic polymer containing a reactive silicon group having three hydrolyzable groups and, as a curing catalyst, (B2) a tetravalent tin compound. |
| priorityDate |
2010-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |