http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2565906-A1

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filingDate 2011-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0c138a78f2033b0da139a4ed2704110
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publicationDate 2013-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-2565906-A1
titleOfInvention Epitaxial substrate and process for producing epitaxial substrate
abstract Provided is a crack-free epitaxial substrate having excellent breakdown voltage properties in which a silicon substrate is used as a base substrate thereof. An epitaxial substrate in which a group of group-III nitride layers are formed on a base substrate made of (111)-oriented single crystal silicon such that a (0001) crystal plane of the group of group-III nitride layers is substantially in parallel with a substrate surface of the base substrate includes: a buffer layer including a composition modulation layer that is formed of a first composition layer made of AlN and a second composition layer made of Al x Ga 1-x N (0≤x<1) being alternately laminated; and a crystal layer formed on the buffer layer. The relationship of x(1)≥x(2)≥...≥x(n-1)≥x(n) and x(1)>x(n) is satisfied, where n represents the number of laminations of each of the first composition layer and the second composition layer (n is a natural number equal to or greater than two), and x(i) represents the value of x in i-th one of the second composition layers as counted from the base substrate side, to thereby cause a compressive strain to exist such that the compressive strain increases in a portion more distant from the base substrate.
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