| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1d49980ffc25e6bf531d6a34fa82b4c2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5435
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3445
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate |
2011-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a96f07853f5bc7cfb9817924f46f22d8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6c3736f67da70c377c97d5c5d0fe534
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87992628f5e2c8d08b84e38c5daaf152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c8185a31b55bd7f6520594aa233813cd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c1c0700f36f8dbc90d917de0a75a6e8 |
| publicationDate |
2013-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2561029-A2 |
| titleOfInvention |
One part epoxy resin including a low profile additive |
| abstract |
An adhesive composition comprising: (i) a one part curable epoxy adhesive and (ii) a low profile additive (LPA), the low profile additive being a polymer that is compatible with the epoxy adhesive such that it forms a single phase when admixed with the adhesive composition and that separates from the adhesive to form a network of stress-absorbing nodules therein when the adhesive is cured, the low profile additive being present in an amount sufficient to prevent or reduce shrinkage and/or the formation of voids or cracks when the adhesive is cured. In one embodiment the LPA is a block copolymer including at least one flexible block and at least one rigid block that makes the low profile additive compatible with the epoxy adhesive such that a mixture of the uncured epoxy resin and the low profile additive forms a homogenous solution and as the epoxy resin is cured, the low profile additive forms a stress absorbing network of nodules in the cured epoxy resin matrix. |
| priorityDate |
2010-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |