| abstract |
The invention has been made focusing on the problems of the prior art. Specifically, the invention aims to provide a hot melt adhesive film which can be used for preparing a laminate at low temperatures, has sufficient adhesion and sufficient heat resistance, and is excellent in workability. Provided is an adhesive resin composition, essentially comprising: a base resin which comprises (A) 30-90 parts by weight of a modified ethylene-olefin copolymer, and (B) 70-10 parts by weight of a styrene thermoplastic elastomer, provided that (A) + (B) equals 100 parts by weight; and (C) a tackifier in an amount of 30-60 parts by weight per 100 parts by weight of the base resin, the modified ethylene-olefin copolymer being one which has been graft-modified with (a) an unsaturated carboxylic acid or a derivative thereof and (b) an aromatic vinyl monomer, comprises 0.1%-5% by weight of (a) the unsaturated carboxylic acid or the derivative thereof, and has a melting point peak in a range of 100-150°C with an enthalpy of crystal fusion of 0.5-10 J/g as determined by DSC. |