| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2848
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31663
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-35121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-70 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate |
2012-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad8c1a4d20636140bf1c5899f9e5268c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_329e3054458f4ade1f74e6321b433690
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23cfb055bf88286becaa503a8173bab7 |
| publicationDate |
2013-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2551322-A1 |
| titleOfInvention |
Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method |
| abstract |
A laminate comprising a support (2), a temporary adhesive layer (3), and a wafer (1) having a circuit-forming front surface and a back surface to be processed allows for processing the wafer. The temporary adhesive layer consists of a first temporary bond layer (A) of thermoplastic organosiloxane polymer which is releasably bonded to the front surface of the wafer and a second temporary bond layer (B) of thermosetting modified siloxane polymer which is laid contiguous to the first temporary bond layer and releasably bonded to the support. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10950481-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3579267-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I608072-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3041028-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10501710-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8999817-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10453732-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3240016-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3173453-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2634794-A1 |
| priorityDate |
2011-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |