| abstract |
A substrate 1 for mounting an element, comprising a low temperature co-fired ceramic substrate 2, a thick film conductor layer 3 made of a metal composed mainly of silver, which is formed on the surface of the low temperature co-fired ceramic substrate 2, a covering 4 made of a low temperature co-fired ceramic, which covers the edge portion 31 of the thick film conductor layer 3 and which is bonded to the low temperature co-fired ceramic substrate 2 on the outer side of the edge portion 31, and a plated layer 5 made of an electrically conductive metal, which is formed on the surface of the thick film conductor layer 3. |