| abstract |
The present invention relates to a polymer composition comprising the following components: a) 76,6 - 99,49 mass% of aromatic polycarbonate, b) 0,5 - 20 mass% of laser direct structuring additive, c) 0 - 2,4 mass% of rubber like polymer, and d) 0,01 -1 mass % of acid and/or acid salt wherein the mass% is calculated relative to the sum of a), b), c) and d). The invention also relates to a moulded part containing this composition, to a circuit carrier containing such moulded part and to a process for producing such circuit carrier. |