| abstract |
The bonding apparatus comprises: a substrate supporting section (5) for supporting a substrate (1), on which semiconductor devices (3) have been adhered, in a state where the substrate (1) is separated from a clamping face (6a, 17a) of a second die (6, 17); and a heating/pressing section (10, 28) for heating and pressing the substrate (1) supported by the substrate supporting section (5) onto a clamping face (10a, 28b) of a first die (8, 24). The heating/pressing section (10, 28) moves the substrate (1) toward the clamping face (10a, 28b) of the first die (8, 24) so as to preheat the substrate (1) and the semiconductor devices (3). The semiconductor devices (3) are pressed onto the clamping face (10a, 28b) so as to cure the non-conductive adhesive (2) and bond the bumps (3a) of the semiconductor devices (3) to terminal sections (1a) of the substrate (1). |