Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6627 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1903 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13034 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19051 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P5-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P5-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-057 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-057 |
filingDate |
2010-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d7eae3b505b563e2c14e06f06df3645 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08c92781deacb10cfbe900720e26d463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bef5b1a58bda8caca7776ffd5df91f38 |
publicationDate |
2012-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-2485253-A1 |
titleOfInvention |
Package for containing element and mounted structure |
abstract |
A device housing package (1) includes a substrate (3) having a device (2) mounting region (R) in an upper face thereof; and a frame body (4) having a through hole (H) formed in part thereof, the frame body being disposed on the substrate (3) so as to lie along a periphery of the device mounting region (R). The device housing package (1) includes an input-output terminal (5) disposed in the through hole (H), the input-output terminal having a first dielectric layer (7) extending interiorly and exteriorly of the frame body (4); a signal line (8) formed on the first dielectric layer (7) and configured to provide electrical connection between an interior of the frame body (4) and an exterior thereof; a first ground layer (9a) formed on a lower face of the first dielectric layer (7); a second dielectric layer (10) formed on the signal line (8) so as to overlap the frame body (4) as viewed in a transparent plan view; a second ground layer (9b) formed on an upper face of the second dielectric layer (10); and a metal layer (11) disposed within the second dielectric layer (10) so as to extend from the interior of the frame body (4) to the exterior thereof along the signal line (8). The metal layer (11) is formed to extend from the second dielectric layer (10) to the first dielectric layer (7), being separated from the signal line (8). |
priorityDate |
2009-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |