http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2485253-A1

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filingDate 2010-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d7eae3b505b563e2c14e06f06df3645
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publicationDate 2012-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-2485253-A1
titleOfInvention Package for containing element and mounted structure
abstract A device housing package (1) includes a substrate (3) having a device (2) mounting region (R) in an upper face thereof; and a frame body (4) having a through hole (H) formed in part thereof, the frame body being disposed on the substrate (3) so as to lie along a periphery of the device mounting region (R). The device housing package (1) includes an input-output terminal (5) disposed in the through hole (H), the input-output terminal having a first dielectric layer (7) extending interiorly and exteriorly of the frame body (4); a signal line (8) formed on the first dielectric layer (7) and configured to provide electrical connection between an interior of the frame body (4) and an exterior thereof; a first ground layer (9a) formed on a lower face of the first dielectric layer (7); a second dielectric layer (10) formed on the signal line (8) so as to overlap the frame body (4) as viewed in a transparent plan view; a second ground layer (9b) formed on an upper face of the second dielectric layer (10); and a metal layer (11) disposed within the second dielectric layer (10) so as to extend from the interior of the frame body (4) to the exterior thereof along the signal line (8). The metal layer (11) is formed to extend from the second dielectric layer (10) to the first dielectric layer (7), being separated from the signal line (8).
priorityDate 2009-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 38.