Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-52 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-52 |
filingDate |
2011-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b6b33365e10c85c49ffde5478491ae9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9194bdfff63eae6e51b341039bdc98d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd7e94f66d2edcdaa0e88972acfab215 |
publicationDate |
2012-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-2481835-A1 |
titleOfInvention |
Autocatalytic plating bath composition for deposition of tin and tin alloys |
abstract |
An autocatalytic tin plating bath containing Sn 2+ ions, Ti 3+ ions as reducing agent, an organic complexing agent and phenanthroline or a derivative thereof as stabilizing agent is disclosed. The plating bath is suitable for manufacture of printed circuit boards, lC substrates and metallization of semiconductor wafers. |
priorityDate |
2011-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |