| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_664f5b543543aac4cf0153a4ef4e0f85 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2110-0066 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D18-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-4854
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-7621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-4238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D13-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-28 |
| filingDate |
2010-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6a77767e87dbeb834ca2e26f335980d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a9aeb2ee64748ba0b316378b48f8b94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ae9e271102187c05062314a0a3f58e4 |
| publicationDate |
2012-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2462178-A1 |
| titleOfInvention |
Polyurethane composition for cmp pads and method of manufacturing same |
| abstract |
Polyurethane composition based on a certain polyether and polyester prepolymer reaction mixture, wherein the composition is utilized in manufacturing chemical mechanical polishing/planarizing (CMP) pads. The CMP pads have low rebound and can dissipate irregular energy as well as stabilize polishing to yield improved uniformity and less dishing of the substrate. |
| priorityDate |
2009-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |