| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_029116ee41eeec8a03f88a8cddbaa758 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61F2-9524
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2995-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61F2-9522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61F2-9526
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61F2210-0004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2031-753
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C61-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2023-007 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61F2-82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61L31-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61L31-148
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61L31-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61L27-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61F2-82 |
| filingDate |
2010-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b397c30e9df1a727da57eebcd9e1f30 |
| publicationDate |
2012-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2440162-A1 |
| titleOfInvention |
Crosslinked bioabsorbable medical devices |
| abstract |
The present invention is directed to bioabsorbable medical devices which are introduced into the body of a subject in a first configuration and deformed in the subject's body to a second configuration. The devices (110) generally include at least one bioabsorbable expandable device component that comprises at least one type of biodegradable polymer. In accordance with an aspect of the invention, the expandable device component is crosslinked while in an expanded configuration. The crosslinked device component is then heated to a temperature above the glass transition temperature (Tg) of the material forming the device component. Upon heating to this temperature, the device component is compressed into a contracted configuration and cooled to below the Tg of the material to maintain the contracted configuration. |
| priorityDate |
2009-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |