| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_145155e5afa6f64badcf9601855c0204 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85464
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48764
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48664 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-54 |
| filingDate |
2010-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de2b8306f194b08e8a4848826296c171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7294d084aa4bd010addb24e313c267cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe0c12c07cf856ba13699fd3e95f1529
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34af32cf248b9fd60821b0ae1067a7a4 |
| publicationDate |
2013-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2435600-B1 |
| titleOfInvention |
Method for depositing a palladium layer suitable for wire bonding on conductors of a printed circuit board and palladium bath for use in said method |
| priorityDate |
2009-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |