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filingDate 2011-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2012-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-2434524-A2
titleOfInvention Methods of sputtering using a non-bonded semiconducting target
abstract A sputtering cathode 10 is generally provided. The sputtering cathode 10 can include a semiconducting target 12 (e.g., a cadmium sulfide target, a cadmium tin oxide target, etc.) defining a sputtering surface 14 and a back surface 16 opposite to the sputtering surface 14. A backing plate 18 can be positioned facing the back surface 16 of the target 12 and non-bonded to the back surface 16 of the target 12. A non-bonding attachment mechanism can removably hold the target 12 within the sputtering cathode 10 such that the back surface 16 is facing the backing plate 18 during sputtering.
priorityDate 2010-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 23.