Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_708c6fc3399004e7763740f50c5fe635 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3414 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3426 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3435 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-34 |
filingDate |
2011-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6f1d8345d706755cb44f916de4b35bd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb655027c5b73f999c6af0b418c99205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2371e2382eae880be3c52020e59b0d60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d68a12fcf7b93b1b7ed10d001bce7729 |
publicationDate |
2012-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-2434524-A2 |
titleOfInvention |
Methods of sputtering using a non-bonded semiconducting target |
abstract |
A sputtering cathode 10 is generally provided. The sputtering cathode 10 can include a semiconducting target 12 (e.g., a cadmium sulfide target, a cadmium tin oxide target, etc.) defining a sputtering surface 14 and a back surface 16 opposite to the sputtering surface 14. A backing plate 18 can be positioned facing the back surface 16 of the target 12 and non-bonded to the back surface 16 of the target 12. A non-bonding attachment mechanism can removably hold the target 12 within the sputtering cathode 10 such that the back surface 16 is facing the backing plate 18 during sputtering. |
priorityDate |
2010-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |