| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4fd9607748d2339b5bda6af3468f084b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H02B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34 |
| filingDate |
2010-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f48b1e41fd3acc88b7d6ffd3421bb8a3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79e9f1e990c97f049e03d1550f6c4a3a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbd307e60df8783c63b6f20ac6f50f24 |
| publicationDate |
2013-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2414444-B1 |
| titleOfInvention |
Direct overmolding |
| abstract |
Disclosed is a curable composition comprising an epoxy resin and a filler composition, a cured product obtained by curing said curable composition as well as the use of the cured products as electrically insulating construction material for electrical or electronic components. |
| priorityDate |
2009-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |