Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4fd9607748d2339b5bda6af3468f084b |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-346 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02B13-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H02B13-00 |
filingDate |
2010-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbd307e60df8783c63b6f20ac6f50f24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79e9f1e990c97f049e03d1550f6c4a3a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f48b1e41fd3acc88b7d6ffd3421bb8a3 |
publicationDate |
2012-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-2414444-A1 |
titleOfInvention |
Direct overmolding |
abstract |
Disclosed is a curable composition comprising an epoxy resin and a filler composition, a cured product obtained by curing said curable composition as well as the use of the cured products as electrically insulating construction material for electrical or electronic components. |
priorityDate |
2009-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |