Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07F9-657172 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07F9-6574 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07F9-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F9-6574 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
filingDate |
2009-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51b45ae4ee03544a3f341ead0b559b3d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4281dc619e35902a12f44a577f96ad3a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45206fa9221726350813a38c0c8b2dec |
publicationDate |
2012-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-2409979-A1 |
titleOfInvention |
Process for production of phosphorus-atom-containing phenol, novel phosphorus-atom-containing phenol, curable resin composition, cured product thereof, printed circuit board, and semiconductor sealing material |
abstract |
Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a phenolic resin as the phenol, a novel phosphorus-containing phenolic compound that serves as a curing agent for an epoxy resin and imparts excellent heat resistance to a cured product; a curable resin composition containing the novel phosphorus-containing phenolic compound; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is allowed to react with an organic phosphorus compound (a2) intramolecularly having a P-H group or a P-OH group. The resultant reaction product is then allowed to react with a phenol (a3). |
priorityDate |
2009-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |