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filingDate 2010-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8980688eec5eabbc8fa8a18536e881a
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publicationDate 2011-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-2400540-A1
titleOfInvention Vacuum sealed package, printed circuit board having vacuum sealed package, electronic device, and method for manufacturing vacuum sealed package
abstract A vacuum sealed package includes a package main body portion in which a first main body portion and a second main body portion are bonded via a hollow portion, and a getter material and an electronic device that are provided within the hollow portion, and in the state of the hollow portion being evacuated via a through-hole that brings the inside and the outside of the hollow portion into communication, the package main body portion is sealed with a sealing member, the getter material and the electronic device are connected to a first conductor pad and a second conductor pad, the first conductor pad is connected with a third conductor pad via a thermally conductive material, and the second conductor pad is electrically connected with a fourth conductor pad on a wiring substrate.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9425118-B2
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priorityDate 2009-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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