| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a3d52eacd83e723ebd2ca61b598586c2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2021-887 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-8806
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-9501 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-88
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-95 |
| filingDate |
2010-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1c6a1306e2d97fdb9062f59da108171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d046494aff2c6afc49a616e6390f5f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11380c1170e92a310b1826e6d38fbd1c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e61b589a94436f165d21564abc48c257
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84172efb5caf6e65a58f5e60be97ba93
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_96fb52b539bee1f646931c019e39e32c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa7bd2bfcc18146e6b886d672f03a8ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51c2ddcd62662ca4e644c6a25c7dab0a |
| publicationDate |
2011-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2389685-A2 |
| titleOfInvention |
Systems and methods for detecting defects on a wafer |
| abstract |
Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data. |
| priorityDate |
2009-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |