| abstract |
Interconnection structure (100) comprising: at least one first substrate whose at least one first face is secured to at least one face of at least one second substrate; at least one blind via passing through the first substrate and opening at the first face of the first substrate and a second face, opposite to the first face, of the first substrate, at least one electrical contact (114, 120) disposed against said face of the second substrate and facing the blind via, and / or against the first face and / or against the second face of the first substrate, at least one channel (116) communicating the blind via with an environment outside the interconnection structure and / or with at least one cavity formed in the interconnection structure, and extending substantially parallel to the one of said faces of the first or second substrate. |