| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b2b31f8612f522a744762d83c23879ba |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49117
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0277
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4814
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4867
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate |
2009-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b15dd8745b92718907c593cb353152e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c30574c40fd1f801b70065770c00de3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e472d45e8786050118cfba02dd5b0d06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_860f6b6776195cdd54533c372c323db8 |
| publicationDate |
2011-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2339624-A2 |
| titleOfInvention |
Multi-layer interconnection structure manufacturing method thereof |
| abstract |
Provided are a multi-layer interconnection structure and a manufacturing method thereof. The multi-layer interconnection structure includes a substrate; a first wiring on the substrate; an interlayer insulation layer on the first wiring; a second wiring on the interlayer insulation layer; and a via contact including at least one conductive filament penetrating through the interlayer insulation layer between the second wiring and the first wiring to be electrically connected to the first wiring and the second wiring. |
| priorityDate |
2009-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |