| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2b64c35abf689a3a032c90afaddb107c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-257
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-256
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-252 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 |
| filingDate |
2009-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67bbfb4cf45ce651a3b46c36a77f8c93
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc6019f51f59724eb1d434909461da4d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_991e7ad61d87542ea04038f66a96242d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e40522fcc8ced471a6592ba9dca24063 |
| publicationDate |
2013-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2325000-B1 |
| titleOfInvention |
Highly heat conductive polyimide film, highly heat conductive metal-clad laminate and method for producing same |
| abstract |
Provided is a highly heat conductive metal-clad laminate which shows heat resistance, dimensional stability, workability, and adhesiveness and excellent thermal conductivity properties. Also provided is a highly heat conductive polyimide film. The highly heat conductive metal-clad laminate has a metal layer on one or both sides of an insulating layer which has a heat conductive filler-filled polyimide layer. The insulating layer of the highly heat conductive metal-clad laminate or the highly heat conductive polyimide film having the filler-filled polyimide layer is characterized in that the content of the heat conductive filler in the filler-filled polyimide layer is 20-80 wt%, the heat conductive filler contains a plate-like filler with an average length D L of 0.1-15µm and a spherical filler with an average particle diameter D R of 0.05-10µm, D L and D R satisfy the relationship D L >D R /2, no heat conductive filler of 30 µmor more is contained, and the coefficient of thermal expansion is in the range of 10-30 ppm/K. |
| priorityDate |
2008-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |