| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1692
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1291
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12458
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12569
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C10-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D7-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C19-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-50 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C19-03 |
| filingDate |
2009-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7aaec27090ebcfddf1ea17cdf6994cec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71962fd1f10cbf048b0c54f19b0dd9ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_254aaa22f13e211154b858f455bdc6fa |
| publicationDate |
2011-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2295618-A1 |
| titleOfInvention |
Composite material for electrical/electronic component and electrical/electronic component using the same |
| abstract |
A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part, containing: na metal base material having at least a surface formed of Cu or a Cu alloy; and nan insulating film provided on at least a part of the metal base material; n nwherein a metal layer having Cu diffused in Ni or a Ni alloy is interposed between the metal base material and the insulating film; and nwherein the ratio of the number of Cu atoms to the number of Ni atoms (Cu/Ni) obtained by analyzing the outermost surface of the metal layer by Auger electron spectroscopy is 0.005 or more. |
| priorityDate |
2008-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |