Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_61080e1b5f97a1c2066cddcf8a2e877b |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1305 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28D2015-0225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01015 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28D15-043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-427 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00119 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-427 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F28D15-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-473 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B1-00 |
filingDate |
2001-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e415152bd778fe1eb176f1fee6c339ec http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b3b4cba1d80a3803e89fecfc7cae3a2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41721f55f87c150aa9d7e024f21684e2 |
publicationDate |
2011-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-2289844-A2 |
titleOfInvention |
Thermally enhanced microcircuit package and method of forming same |
abstract |
A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid. |
priorityDate |
2000-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |