| abstract |
A method of forming an electronic device (100) provides an electronic device substrate (140) having a solder bump pad (150) located thereover. A nickel-containing layer (320) is located over the solder bump pad (150). A copper-containing layer (310,510) is formed on the nickel-containing layer (320) prior to subjecting the electronic device (100) to a reflow process. Sn-Ag solder is used. The copper-containing layer (610,620) may alternatively be formed on a solder bump (110'). |