| abstract |
The present invention relates to a resin composition comprising resin (A), a filler (B) and a solvent (C), wherein the solvent (C) contains at least one organic solvent selected from a group consisting of propylene carbonate, dimethylsulfoxide and sulfolane; a cured film obtained by curing the resin composition; and use of the cured film as an overcoat for electronic circuit boards or the like. The resin composition of the present invention has a high filtration rate when it is prepared and has excellent productivity. A cured film obtained by curing the resin composition has excellent long-term electric reliability and is useful in the fields of solder resists, electrical insulating materials such as interlayer dielectric films, encapsulating materials for ICs and ultra LSIs, laminates and the like. |