http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2270020-A1
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d5d04736b0b882a4f5a1e0e0e4cd8cbb |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07F7-21 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F7-21 |
filingDate | 2009-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0db0e60d0ed73a2d552bc4a6e2ceb077 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ac176c466b1c59856c25456c2d1ac9e |
publicationDate | 2011-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | EP-2270020-A1 |
titleOfInvention | Epoxy compound and process for producing the epoxy compound |
abstract | An object of the present invention is to provide an epoxy compound which has a quick curing rate and is excellent in an etching durability and a selectivity and which is liquid at room temperature and a process for producing the above epoxy compound. The epoxy compound of the present application is represented by Formula (I): n n (Y S i O 3/2 ) n (I) n n(in Formula (I), p (p is a natural number equal to n or less) groups of Y out of n groups thereof represent specific groups, and (n - p) groups of Y represent a hydrogen atom or -OSiR 1 2 H; and n represents an integer of 2 to 500). |
priorityDate | 2008-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 108.