http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2255941-A1
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_14df928cce1112b89356928855b60351 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B3-0031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-3878 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29D11-00365 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B1-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29D11-00307 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29D11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B3-00 |
filingDate | 2009-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b05c7fd0cfef8f11fc8cc6d5e56a763 |
publicationDate | 2010-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | EP-2255941-A1 |
titleOfInvention | Method for producing wafer lens |
abstract | Provided is a method for producing a wafer lens easily, while reducing production cost and exhibiting good mold releasability. A method for producing a wafer lens comprises a step of forming a master molding die having a plurality of positive mold surfaces corresponding to the optical surface shape of an optical member, a step of performing surface modification of the mold surface of the master molding die, a step of coating the mold surface of the master molding die with a mold release agent having a structure wherein a hydrolyzable functional group is bonded to an end, a step of forming a submaster molding portion having a plurality of negative mold surfaces corresponding to the optical surface shape of the master molding die by molding a second curable resin, a step of forming a submaster molding die by backing the submaster molding portion with a submaster substrate, and a step of molding an optical member by filling the gap between the submaster molding die and the substrate with a first curable resin and then curing the resin. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2650705-B1 |
priorityDate | 2008-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 247.