http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2222144-A2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6572309f22e2ad56c1390a78ac237bed |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0191 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-093 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-167 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09309 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0317 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0326 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0234 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate | 2007-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25de21172f8d9af52aaa3063cdeb318f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8357edfadb3cf4914d62d3678cdb61d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d15f29bdde04ff42495f5c92760598f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd1648c318d1667bbacfc7a1af03fa52 |
| publicationDate | 2010-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-2222144-A2 |
| titleOfInvention | Noise suppressing structure and printed wiring board |
| abstract | The present invention relates to a wiring member including: a copper foil layer having a smooth surface with a surface roughness Rz of 2 µm or less; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness of 5 to 200 nm; and an insulating resin layer provided between the smooth surface of the copper foil layer and the noise suppressing layer, and also relates to a printed wiring board equipped with the wiring member. Moreover, the present invention relates to a noise suppressing structure including: a first conductive layer; a second conductive layer; a noise suppressing layer provided between the first conductive layer and the second conductive layer, the noise suppressing layer being to be electromagnetically-coupled with the first conductive layer, the noise suppressing layer comprising a metallic material or a conductive ceramic, and the noise suppressing layer having a thickness of 5 to 300 nm; a first insulating layer provided between the first conductive layer and the noise suppressing layer; and a second insulating layer provided between the second conductive layer and the noise suppressing layer; wherein the noise suppressing structure has: a region (I) in which the noise suppressing layer and the first conductive layer face each other; and a region (II) in which the noise suppressing layer and the first conductive layer do not face each other but the noise suppressing layer and the second conductive layer face each other, the regions (I) and (II) neighboring each other. |
| priorityDate | 2006-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 103.