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publicationDate 2010-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-2200080-A2
titleOfInvention Low Cost Manufacturing of Micro-Channel Heatsink
abstract A cooling device (10) includes a ceramic substrate (16) with a metal layer (22) bonded to an outer planar surface (18). The cooling device (10) also includes a channel layer (24) bonded to an opposite side of the ceramic substrate (16) and a manifold layer (26) bonded to an outer surface (28) of the channel layer (24). The substrate layers (16), (22), (24), (26) are bonded together using a high temperature process such as brazing to form a single substrate assembly (14). A plenum housing (30) is bonded to the single substrate assembly (14) via a low temperature bonding process such as adhesive bonding and is configured to provide extended manifold layer inlet and outlet ports (32), (34).
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