| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1476752f2420c8f8eb53464cf7fc922b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-40 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-742
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68707
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K3-0623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68728 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-687
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate |
2006-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc5ad7fd573be7e8e5e41448fab04790
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ef5a7eeb450781ae8d371ec0a117df6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_016fb0de7afa72cd860d28ef4284f323 |
| publicationDate |
2010-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2197027-A2 |
| titleOfInvention |
Positioning stage, bump forming apparatus equipped with the positioning stage, and bump forming method performed using the positioning stage |
| abstract |
A positioning stage that can prevent an excessive force from being imparted to a positioned wafer, a bump forming apparatus equipped with such a positioning stage, and a bump forming method performed using such a positioning stage are provided. n A biasing member 26 that biases a wafer 2 towards a positioning member 28 has a contact surface 26s that substantially faces a wafer-holding surface 24a at an angle. The contact surface 26s is in contact with an outer periphery area of the wafer 2 so as to bias the wafer 2 slantwise towards the wafer-holding surface 24a. With a resiliently deformable member 27, the positioning member 28 is brought into contact with the wafer 2 and is held at a positioning position. When a bias force exceeding a predetermined magnitude is imparted to the positioning member 28, the resiliently deformable member 27 becomes resiliently deformed so as to allow the positioning member 28 to recede from the positioning position. |
| priorityDate |
2005-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |