| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063a1b324005ddc15e16e7529c6258c4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2471-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2371-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24994
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31529
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3417
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-249
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate |
2008-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2012-08-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c65c12aa56066b803e2895b78159494
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5ad16ab91003094ab321c9c47e4991e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de5d15c2b03552817ac41201a3702dac |
| publicationDate |
2012-08-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2194098-B1 |
| titleOfInvention |
Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board |
| abstract |
Disclosed is an epoxy resin composition essentially containing an epoxy compound, a low-molecular-weight phenol-modified polyphenylene ether and a cyanate compound. This epoxy resin composition is excellent in dielectric characteristics and exhibits high heat resistance, while maintaining flame retardancy. Specifically disclosed is an epoxy resin composition which is a thermosetting resin composition composed of a resin varnish containing an epoxy compound (A) having a number average molecular weight of not more than 1000 and containing at least two epoxy groups in a molecule without containing a halogen atom, a polyphenylene ether (B) having a number average molecular weight of not more than 5000, a cyanate ester compound (C), a curing catalyst (D) and a halogen flame retardant (E). This epoxy resin composition is characterized in that the components (A)-(C) are dissolved in the resin varnish, while the component (E) is not dissolved but dispersed in the resin varnish. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016074289-A1 |
| priorityDate |
2007-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |