http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2185621-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7f9af914ed2fb00cd4f1b8b1a28964e4 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B1-04 |
| filingDate | 2008-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb3b77a4ca0dcf6464a964fc809ad66f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5193cdd1282a80464706a610e60e71d5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6aae61633d3f0dcb9bb3e243bc796a98 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39cbafd87eb3c0e7ed7037f57f66d448 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34cbb2f47cf7c3c91ecd636aa974ba2f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95f5cb5fa04cc2da18bde19613712c7d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9e33affddf2806bc8010f3a03764e4f |
| publicationDate | 2010-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-2185621-A1 |
| titleOfInvention | Curable resin composition for molded bodies, molded body, and production method thereof |
| abstract | The present invention provides a curable resin composition which exhibits the following properties: excellent basic performances such as heat resistance; sufficient optical characteristics such as transparency; and excellent demoldability when a molded body of the composition is demolded at the time of molding. The present invention further provides a molded body obtainable by molding the curable resin composition and a production method thereof. A curable resin composition for molded bodies, including a thermocurable resin, wherein the curable resin composition for molded bodies includes at least one compound selected from the group consisting a compound having a boiling point of 260 degrees C or less at one atmospheric pressure, a silicon compound having a polyoxyalkylene chain, a silicon compound having an aryl group, and a silicon compound having a polyoxyalkylene chain and an aryl group. |
| priorityDate | 2007-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 1107.