| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1bc30ca26ac5faed5c136ab10bd34141 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65D81-3453
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P20-582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2367-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2439-70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2467-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-0427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65D81-343
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65D81-2015 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D81-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D77-20 |
| filingDate |
2008-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3aace79daf84dd8089659fcd24a4a172
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7c617eb65baf4bc2ebc7d10849aa998 |
| publicationDate |
2010-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2185359-A2 |
| titleOfInvention |
Dual ovenable food package having a thermoformable polyester film lid |
| abstract |
The invention provides an ovenable vacuum skin package for storage and cooking of a food product. The package includes a receptacle and a thermoformable composite polymeric film cover heat-sealed thereto, and the composite polymeric film cover includes: (i) a thermoformable substrate layer comprising a first copolyester material; and (ii) on a surface of the substrate layer, a heat-sealable layer comprising a second copolyester material, the second copolyester material being different from the first copolyester material; wherein i. the receptacle comprises on a surface thereof a sealing region adapted to contact and form a seal with the heat-sealable layer; and ii. both the receptacle and the cover film comply with the requirements of paragraph h(1) of 21 CFR ยง 177.1630. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022064189-A1 |
| priorityDate |
2007-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |