http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2183335-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f75c33ae35e5d1dc4b05e62ec461c17f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-122 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-383 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-00 |
| filingDate | 2008-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c7c75cc1fc6748b74b75e57b8489566 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6b6b64aebed791b8e67640d6ec0100a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c7b961222a0b239a198e4187d4b2e09 |
| publicationDate | 2010-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-2183335-A1 |
| titleOfInvention | Microetching composition and method of using the same |
| abstract | The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface. |
| priorityDate | 2007-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 137.