| abstract |
The invention relates to a molding compound for joining two molded parts made of a PA11 and/or PA12 molding compound, comprising at least 50 wt.% of a polyamide component that is selected such that the same can be produced from linear aliphatic diamines and dicarboxylic acids, or lactams, or ?-amino carboxylic acids, wherein 11 to 12 carbon atoms are present in the recurring units per carbonamide group, and wherein said polyamide component further comprises a maximum of 80 wt.% of one of the polyamides PA11 and PA12. In this manner, a strong welded connection is obtained both for a PA11 molded part and for a PA12 molded part. |