http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2100754-B1

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filingDate 2007-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47069ff4b9ae54e0f593a5aaaddb8a38
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publicationDate 2011-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-2100754-B1
titleOfInvention Integrated circuit tag, tire fitted with it and method of fitting it to a tire
abstract At tire vulcanization molding, debonding of IC tag inlet is inhibited while preventing any bonding in areas other than side drop. The IC tag comprises sheet-shaped IC tag inlet (2), protective cover (3) of unvulcanized rubber sheet bonded via primer layer (10) and adhesive layer (11) to the surface (Sf) thereof and antisticking layer (4) provided on the backside (Sr) of the IC tag inlet (2). The maximum value (Ga'max) of the storage shear modulus (Ga') of the rubber of the protective cover (3) at temperature ranging from 150° to 200°C and the storage shear modulus (Gb'0) of the primer layer (10) at temperature T0 exhibiting the maximum value (Ga'max) satisfy the formula (1): Ga'max × 10-2 < Gb'0 (1).
priorityDate 2006-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 29.