| abstract |
There is provided a polyamide resin that can achieve a sufficiently high molecular weight compared to conventional polyamide 92, has a broad moldable temperature range or width estimated from a difference between melting point and thermal decomposition temperature, exhibits excellent melt moldability and has excellent chemical resistance and hydrolysis resistance compared to conventional aliphatic polyamide resins without impairing low water absorption property of an aliphatic linear polyoxamide resin. A polyamide resin in which the dicarboxylic acid component is oxalic acid and the diamine component is a diamine component composed of 1,9-nonanediamine and 2-methyl-1,8-octanediamine, with the molar ratio between 1,9-nonanediamine and 2-methyl-1,8-octanediamine being from 6:94 to 99:1. |