http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2088841-A2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38e72bf35b2c9cf15b388d0378b79abd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1316 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-2018 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10189 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-0034 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-064 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00 |
| filingDate | 2009-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40aecdb77bd9cd23c2c2fa1becfa169d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f158ad5c3d10c1d8d9e39d75e270c0bd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f609a0afd3aabe92cd4c4079ce75b8bf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39b447ae7b3356fd3e2ba27f190c1bed |
| publicationDate | 2009-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-2088841-A2 |
| titleOfInvention | Overmolded electronic assembly with metal seal ring |
| abstract | An improved overmolded electronic assembly includes a backplate, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, a metal ring on an outer side of a thermoplastic wall member of the electrical connector, and an overmold body. The metal ring circumscribes external connector pins of the electrical connector, and the overmold body together with the backplate and thermoplastic wall member of the electrical connector sealingly encase the circuit substrate and the circuit device defined on the substrate, with the overmold body having a peripheral edge in adhesive contact with the metal ring. The invention avoids delamination problems associate with similar arrangements which do not incorporate a metal ring. |
| priorityDate | 2008-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.