| abstract |
The objective of the present invention is to provide a heat-dissipating resin composition that is used for forming a substrate for LED mounting or a reflector provided on the substrate for LED mounting and is excellent in heat dissipation, electrical insulation, heat resistance and light resistance while an LED element emits light, a substrate for LED mounting and a reflector comprising the composition. The present composition comprises a thermoplastic resin such as modified PBT and a thermally conductive filler consisting of scaly boron nitride or the like, and has thermal deformation temperature of 120°C or higher, a thermal conductivity of 2.0 W/(m•K) or higher, and a thermal emissivity of 0.7 or higher. |