Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b7317808024e524eea40a6c5a5ad6a22 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-494 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2002-14475 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61C17-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1433 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61M5-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-162 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1626 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1606 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61M5-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-14 |
filingDate |
2007-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a64196815669121a0f3fadc3e20e2722 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2def70257dbbee4476890697860cb1cf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9314fabd2d3b05a72706caabcf69539a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54da260273c7070792f268feb7c8e61b |
publicationDate |
2009-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-2076394-A1 |
titleOfInvention |
Nozzle for high-speed jetting devices |
abstract |
A nozzle for jetting devices is described comprising e.g. one patterned silicon substrate enabling semiconductor mass production. The method of manufacturing the nozzle is characterized by using one mask layer deposited on the silicon substrate. The etching of the silicon substrate is done by means of a first isotropic etching step and a second anisotropic etching step through the mask layer, resulting in a perfectly aligned nozzle. |
priorityDate |
2006-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |