| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12708
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49149
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12903
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-0238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-341
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3618
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3613 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2006-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_277206121544d2a6d71d6d326dfc8a2e |
| publicationDate |
2009-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2068606-A1 |
| titleOfInvention |
Junction structure, method of joining, wiring board and process for producing the same |
| abstract |
A joint structure of the present invention includes a conductive member containing copper as a major component thereof, an electrode member containing copper as a major component thereof, and a joint portion formed by fusion welding the conductive member and the electrode member with a brazing material containing tin as a major component thereof and containing substantially no copper, wherein the amount of copper atoms contained in the alloy in the central part of the joint portion is higher than that in the outer circumference part. |
| priorityDate |
2006-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |