| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e443fcd44793752f156437bbfd4c8603 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-263
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1352
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2982
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41N1-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41C1-05 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41N1-12 |
| filingDate |
2007-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c32396c9ddaaae3a00d85634f25f665
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ab004c2f0545e980a6d6117d36e3d92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_866f6b8ba3905f82559084ff3ecd2447
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e533e2ff9f0d8c79e7f7bf03db107ad9 |
| publicationDate |
2009-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2060405-A1 |
| titleOfInvention |
Photosensitive resin composition |
| abstract |
Problem to be Solved n To provide a photosensitive resin composition which has good processability even in a relatively low temperature condition near room temperature and exhibits good efficiency in removing debris generated while shaping a printing plate by laser engraving. n Solution n A photosensitive resin composition, characterized by comprising: (a) 100 parts by mass of a resin having a number average molecular weight of 1,000 or more; and (b) 0.1 to 10 parts by mass of ultrafine particles having a number average particle diameter of primary particles of 5 nm or more and 100 nm or less; wherein the photosensitive resin composition has a viscosity at 20°C of 50 Pa·s or more and 10,000 Pa·s or less; and a precursor composition, which is obtained by excluding the component (b) from the photosensitive resin composition, has a viscosity at 20°C of 5 Pa·s or more and 500 Pa·s or less. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009114056-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013016060-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8043787-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8613999-B2 |
| priorityDate |
2006-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |