| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_74973199515dbabd2310245aab03e282 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F05D2300-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F05D2260-95
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F05D2300-611 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F04D29-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F04D29-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-34 |
| filingDate |
2007-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_943e3ab0a5823df2274463c907b65ebb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60547669356dc9231dd3474952b6b1cd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5406a001553004f921b9a99e4450e2d1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34060a830ba3199ac071ef34afda5e0a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d7d4baece344779e7f44694efb3581d |
| publicationDate |
2009-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2058417-A1 |
| titleOfInvention |
Method for forming corrosion resistant plating layer and rotating machine |
| abstract |
An object is to provide a method for forming a superior corrosion-resistant plating layer by sealing penetrating pinholes formed in an electroless plating layer. There are provided a first plating step of performing electroless Ni-P plating on a base material (1); an etching step of etching a surface of a first plating layer (3) formed by the first plating step; and a second plating step of performing electroless Ni-P plating to form a second plating layer (5) on the first plating layer (3) processed by the etching step. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10598186-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3276143-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/IT-CO20120015-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013153020-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10161413-B2 |
| priorityDate |
2006-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |