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filingDate 2007-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2009-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-2049304-A1
titleOfInvention Chemical mechanical polishing pads comprising liquid organic material core encapsulated in polymer shell and methods for producing the same
abstract There is provided a chemical mechanical polishing (CMP) pad including a core of a polymer shell encapsulating a liquid organic material having one of a boiling point and a decomposition point of 130 0C or more in a polymer matrix, the CMP pad having open pores formed by the core on a polishing surface thereof, and a method of producing the CMP pad. The CMP pad having a high hardness and a high density improves polishing efficiency and flatness of a wafer and maintains a uniform size of the core, thereby producing pads having high polishing efficiency and stable polishing performance.
priorityDate 2006-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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